3. April 2019
Fraunhofer IISB, Erlangen
Fraunhofer IISB, Erlangen
Begrüßung
Anton Bauer, Fraunhofer IISB, Erlangen
Wilfried Lerch
Local Temperature Compensation during an RTP Process by Means of an Additional Heating Source
Thorsten Hülsmann, Mattson Thermal Products GmbH, Dornstadt
Millisecond Flash Lamp Annealing and Application for SiGe-HBT
Alexander Scheit, IHP, Frankfurt (Oder)
Combined Magnetron Sputtering- and Flash Lamp Annealing-Tool for Thin Film Processing under Vacuum Conditions
Viktor Begeza, Helmholtz-Zentrum Dresden-Rossendorf, Dresden
Doping of Silicon Nanowires by Ion Implantation and Flash Lamp Annealing
Lars Rebohle, Helmholtz-Zentrum Dresden-Rossendorf, Dresden
Wafer Back-Thinning and Ohmic Contact Formation by Laser Annealing to Reduce ON-Resistance of SiC Power Devices
Carsten Hellinger, Fraunhofer IISB, Erlangen
Morphology Adjustment for Selective Silicon Chemical Vapor Deposition
Alexander Scheit, IHP, Frankfurt (Oder)
am 23. Oktober 2019
bei IMS Chips in Stuttgart