Wide Bandgap & Current Supply Chain Challenges

Wide Bandgap, Environmentally Friendly and Sustainable Semiconductor Technology

SiC Power MOS Technology Evolution - Sustainable and Efficient Energy Conversion in DC Grids
Tobias Erlbacher, Fraunhofer IISB, Erlangen, Germany

Atomic Layer Processing: Interplay between Atomic Layer Deposition and Atomic Layer Etching on the Example of AlGaN/GaN HEMT Structures
Franziska Beyer, Fraunhofer IISB, THM, Freiberg, Germany

SiC Etch & Plasma Dicing Preparation
Steffen Becher, SPTS Technologies, Dresden, Germany

DCVD V(I) Measurements with Topography
Helmut Schönherr, Infineon Technologies Austria, Villach, Austria

In-situ Metrology for Sub-nm Precision in Plasma Etch End-pointing
Marcello Binetti, LayTec AG, Berlin, Germany

Current supply chain challenges

Green Alternatives – Environmental-friendly Processes for DRIE and PECVD Cleaning
Robert Wieland, Fraunhofer EMFT, München, Germany

Elektronik und Optik – Gemeinsamkeiten und Unterschiede bei den Ansprüchen an die Fertigungstechnik
Victor Brasch, Q.ANT, Stuttgart, Germany

xParts – ALD-Beschichtungen zum Schutz von Anlagenteilen in Halbleiterfertigungsprozessen
Kevin Bühlmann, INFICON, Balzers/Liechtenstein