Electrochemical Deposition (ECD), New Developments in Deposition and Etching

Electrochemical Deposition (ECD)
 

Challenges for Cu Metallization in More than Moore Applications
Werner Robl, Infineon Technologies AG, Regensburg, Germany

ECD Cu electrolyte for Next Gen Packaging
Gerhard Steinberger, Atotech Deutschland GmbH, Berlin, Germany

DMR - Direct Metal Replenishment for Sn, SnAg and Cu Electroplating Processes
Nick Maser, ancosys GmbH, Pliezhausen, Germany

Cobalt Metallization on 300 mm Wafer: From CVD to Plating
Lukas Gerlich, Fraunhofer Institute for Photonic Microsystems IPMS – Business Unit Center Nanoelectronic Technologies (CNT), Dresden, Germany

Multiscale Investigation of the Seed Layer Impact on the Electrochemical Deposition
Marcus Wislicenus, Fraunhofer Institute for Photonic Microsystems IPMS – Business Unit Center Nanoelectronic Technologies (CNT), Dresden, Germany

New Developments in Deposition and Etching
 

Simulation of Copper Deposition by ECD and PVD
Andreas Zienert, Fraunhofer ENAS, Chemnitz, Germany

Advances in Doped AlN Deposition Techniques for Next Generation PiezoMEMS
Anthony Barker, SPTS Technologies Ltd., United Kingdom

Development and Scale-up of Alloy Sputter Targets for PiezoMEMS and STT-MRAM Applications
Martin Schlott, Materion Advanced Materials Germany GmbH, Alzenau, Germany

F₂ as Cleaning Gas –Recent Investigations and Resultsofluor – Environmentally-friendly PECVD chamber cleaning?
Michael Enzelberger-Heim¹, Robert Wieland², ¹Texas Instruments Deutschland GmbH, Freising, Germany,
²Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT, Munich, Germany

Quicker from R&D to Line – A „Smart Experiments“ Approach
Sabrina Anger, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany