New Developments in Deposition and Etching

Molecular Vapor Deposition (MVD): a Versatile, Multifunctional Technology with Applications in MEMS, Packaging and Beyond
Mike Grimes, SPTS Technologies Ltd, Newport, United Kingdom

Contact Free MIS Characterisation of CVD Dielectrics
Helmut Schönherr, Infineon Technologies Austria AG, Villach, Austria

Arcing Classification and Clean Optimization in Low Pressure PECVD
Michael Klick, Plasmetrex GmbH, Berlin, Germany

Aspects of high Aspect Ratio Silicon Trench Etching
Matthias Rudolph, Fraunhofer Institute for Photonic Microsystems IPMS – Business Unit Center Nanoelectronic Technologies (CNT), Dresden, Germany

Establishing Smart Plasma Process Control with Combined Sensor Technologies in Production Lines
Thomas Schütte, PLASUS GmbH, Mering, Germany

Advanced Metallization Solutions for Semiconductor Applications
Marco Arnold, BASF, Ludwigshafen am Rhein, Germany

Chemical Process Models with Gas Flow Simulation for DRIE
Michael Klick, Plasmetrex GmbH, Berlin, Germany

Simulation of Layer Profiles and Deposition Rates for Physical Vapor Deposition Processes
Eberhard Bär, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany

Towards Cognitive Power Electronics 4.0 - A Demonstrator for Pump Monitoring
Georg Roeder, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany