November 21, 2005
Fraunhofer IISB, Erlangen
Fraunhofer IISB, Erlangen
Optimization of in situ chamber cleans on AMAT PETEOS and PESilane P5000 tools
Kai-Alexander Schreiber, Infineon Technologies AG, Villach, Austria
Wafer carriers for CVD equipment
Helmut Schönherr, Infineon Technologies AG, Villach, Austria
Using a 0.35 um - 0.25 um gate etcher for critical 0.18 um processes. Problems and process stabilization
Gehard Spitzlsperger, Renesas Semiconductor Europe GmbH, Landshut, Germany
Product enhancements for legacy systems
Thomas Wimmer, Applied Materials GmbH, Dresden, Germany
Extendibility of Sigma fxP for contact and via line application
Norbert Urbansky (1), Paul Rich (2), (1) Infineon Technologies AG, Dresden, Germany, (2)Trikon Technologies Ltd., Newport, United Kingdom