Fraunhofer Institute for Integrated Systems and Device Technology IISBBy combining three-dimensional computed tomography (CT) scans with electro-thermo-mechanical simulations, a non-destructive analysis of power electronic device samples and systems can be performed.
The geometry information of components and areas of interest in the sample are thereby highly resolved down to a few micrometers. The resulting 3D CAD raw data (voxel data) can then be considered within the simulations under realistic boundary conditions. To this end, a variety of commercial and free software packages are available.
Furthermore, custom adjustments and variations of the existing device sample can be investigated using the simulation model, up to an optimization on different system levels.
