Treffen der GMM-Fachgruppe 1.2.6 "Prozesskontrolle, Inspektion & Analytik"

Vorstellung KETEK
Andreas Pahlke, Silvia Wallner, KETEK, München

Defect Inspection and -Analytics for a 28 nm-node-CMP-Process
Maik Wagner-Reetz, Fraunhofer Institute for Photonic Microsystems, Center Nanoelectronic Technologies (IPMS-CNT), Dresden

Defect review by 3D optical profiler and Atomic Force Microscopy
Samuel Lesko, Bruker Nano, Palaiseau, France

High Throughput Microscope Scanners for Accurate Inline Inspections
Sebastian S. Neubauer, Intego GmbH, Erlangen

Contamination Control of new Materials with Modern VPD Techniques
Oliver Luxenhofer, Infineon Technologies Dresden

Yield Enhancement User Group Meeting
Ines Thurner, CONVANIT GmbH & Co. KG, Dresden

Defects in SiC power devices
Johannes Schöck, Fraunhofer IISB, Erlangen

Defect Density Measurement for High Power Semiconductors
Lukas Hitz, ABB Schweiz AG, Semiconductors, Lenzburg/Schweiz

Defect Recognition on Wafers by SIRD
Martin Herms, PVA Metrology & Plasma Solutions GmbH, Jena

Quantitative und höchstauflösende Tiefenprofilanalyse von leichten Elementen mittels Streuung hochenergetischer schwerer Ionen (High Resolution Elastic Recoils Detection)
Gerd Datzmann, Institut LRT2, Universität der Bundeswehr München