Material Characterization

• Get thermal and mechanical properties for finite element simulations (FEM)
• Reveal best material combination for specific application
• Find adequate parameters for processing of solder- and sintering-layers, casting compounds, base plates, housings, terminals, interconnections, windings, dielectrics
• Improve lifetime and reliability of packaging concepts
• Reduce development time and costs

• Temperature dependent characterization of mechanical properties including creep-, fatigue-, fracture- and failure-investigations
• Material property mapping by spatially resolved nanoindentation. Application examples: Properties of intermetallic phases,  die-attaches, bond wires and phase boundaries
• Thermal analysis of materials: Specific heat of semiconductors, die-attaches, solder pastes (evaporation of fluxes, melting temperature, solidification behavior), sintering pastes (drying / sintering time, temperature and atmosphere), substrates, TIMs

• Soldering: All kind of solders (lead-free, lead, gold, etc.)
• Silver-sintering: Representative specimens for tensile tests and nanoindentation (same thickness and porosity as die-attaches or base-plate attaches)
• Wire ultrasonic bonding and resistance welding

Global mechanical material parameters:

• Temperature dependent
• Young’s modulus, tensile-, compressive-, yield-, creep- and fatigue strength
• Different strain rates for time-dependent material behavior
• Stress-strain curves for nonlinear FEM
• Special data for different material models, e.g. Ramberg-Osgood

Local and global mechanical material parameters:

• Temperature dependent
• Young’s modulus, hardness, creep parameters
• 3D-Mapping of material properties
• Quantitative scratch and wear testing
• According to test standard ISO 14577

Thermal material parameters:

• Characteristic temperatures (Sintering, melting, formation of intermetallics, decomposition, oxidation, glass transition)
• Temperature dependent specific heat capacity measurements
• Analyse of peak areas in dependence of mass change
• Kinetics of reactions (e.g. oxidation, sintering)
• Evaluation of mass change steps (leakage of organics, debinding)