CIPS 2024

We would like to thank everyone who visited us at the Fraunhofer IISB booth for the enlightening discussions!

Linked below you find our presentations and posters for CIPS 2024 as PDF files for download. If you have any questions, please don't hesitate to contact the authors!

Modified Approach for the Rainflow Counting Analysis of Temperature Load Signals in Power Electronics Modules
Oral presentation by S. Letz; Co-authors: D. Zhao, J. Leib, B. Eckardt, M. März  

Milliseconds Power Cycling (PCmsec) Driving Bipolar Degradation in Silicon Carbide Power Devices
Oral presentation by S. Laha; Co-authors: D. Momeni, J. Leib, A. Schletz, M. März, C. Liguda, F. Faisal

Challenges of Junction Temperature Calibration of SiC MOSFETs for Power Cycling – a Dynamic Approach
Poster by J. Breuer, F. Dresel, A. Schletz, J. Klier, J. Leib, M. März, B. Eckardt

Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements
Poster by S. Quergfelder,  J. Sax, T. Heckel, B. Eckardt, M. März

CIPS - International Conference on Integrated Power Electronics Systems 2024

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high reliability. Monolithic and hybrid system integration will comprise advanced device concepts including wide bandgap devices, new packaging technologies, and the overall integration of actuators/drives (mechatronic integration).

The CIPS conference consequently focuses on the following topics:

• Assembly and interconnect technology for power electronic devices and converters
• Integration of hybrid systems and mechatronic systems with high power density
• Systems' and components' operational behavior, reliability and availability

Basic technologies for integrated power electronic systems as well as upcoming new important applications are presented in interdisciplinary invited papers.

The CIPS is accompanied by an exhibition which is the communicative core of the conference. Manufacturers, service providers, and research institutions present future and praxis-oriented applications and products.

CIPS 2024 Homepage

ics file with date