Publikationen Mittelspannungselektronik

Jahr Year	Titel/Autor:in Title/Author	Publikationstyp Publication Type
2024	Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements Quergfelder, Simon; Sax, Julian; Heckel, Thomas; Eckardt, Bernd; März, Martin	Konferenzbeitrag Conference Paper
2022	State of the Art Packaging Schletz, Andreas; Endruschat, Achim; Heckel, Thomas	Vortrag Presentation
2021	State of the Art Packaging Schletz, Andreas; Endruschat, Achim; Heckel, Thomas	Vortrag Presentation
2021	Reliability of Silicon-Nitride based High-Voltage Monolithic Capacitors Becker, Tom; Matlok, Stefan; Heckel, Thomas; Böttcher, Norman; Leib, Jürgen; Erlbacher, Tobias	Vortrag Presentation
2020	SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction Rettner, Cornelius; Schiedermeyer, Maximilian; Apelsmeier, Andreas; Heckel, Thomas; Diepgen, Antonia; Klische, Alexander; Dirksen, Daniel; März, Martin	Konferenzbeitrag Conference Paper
2020	Shape Optimization of a Pin Fin Heat Sink Menrath, T.; Rosskopf, A.; Simon, F.B.; Groccia, M.; Schuster, S.	Konferenzbeitrag Conference Paper
2020	State of the Art Packaging Schletz, A.; Endruschat, A.; Heckel, T.	Vortrag Presentation
2020	Genetic Optimization of Pin Fin Heat Sinks Using a Finite Difference Formulation Schuster, Simone; Rosskopf, Andreas; Jung, Verena; Groccia, Mario; Menrath, Thomas	Konferenzbeitrag Conference Paper
2019	Stromrichterschaltung Malipaard, Dirk; März, Martin; Ruccius, Benjamin	Patent
2019	A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Transistors Endruschat, A.; Novak, C.; Gerstner, H.; Heckel, T.; Joffe, C.; März, M.	Zeitschriftenaufsatz Journal Article
2019	State of the Art Packaging Schletz, Andreas; Endruschat, Achim; Heckel, Thomas	Vortrag Presentation
2019	Silicon RC-Snubber for 900 V Applications Utilising non-Stoichiometric Silicon Nitride Boettcher, N.; Heckel, T.; Erlbacher, T.; Pelaic, K.	Konferenzbeitrag Conference Paper
2019	A Cascaded Control Concept for Modular Multilevel Converters with Capacitor Voltage Estimation using a Kalman Filter Ruccius, Benjamin; Kraus, Thomas; Westermann, Robin; Heckel, Thomas; März, Martin; Wagner, Bernhard	Konferenzbeitrag Conference Paper
2019	Bauelement und Verfahren zu dessen Herstellung Eckardt, Bernd; Hofmann, Maximilian; Menrath, Thomas; Schriefer, Thomas	Patent
2018	An advanced control concept for modular multilevel converter using capacitor voltage estimation Ruccius, B.; Preller, B.; März, M.; Wagner, B.	Konferenzbeitrag Conference Paper
2018	Charakterisierung dynamischer Eigenschaften und Modellbildung neuartiger Leistungshalbleiterbauelemente auf Basis von SiC und GaN Heckel, Thomas	Dissertation Doctoral Thesis
2018	Non-linear Input Capacitance Determination of WBG Power FETs using Gate Charge Measurements Gerstner, H.; Endruschat, A.; Heckel, T.; Joffe, C.; Eckardt, B.; März, M.	Konferenzbeitrag Conference Paper
2018	Analytical model for the influence of the gate-voltage on the forward conduction properties of the body-diode in SiC-MOSFETs Huerner, A.; Heckel, T.; Enduschat, A.; Erlbacher, T.; Bauer, A.J.; Frey, L.	Konferenzbeitrag Conference Paper
2018	The 2018 GaN power electronics roadmap Amano, H.; Baines, Y.; Beam, E.; Borga, M.; Bouchet, T.; Chalker, P.R.; Charles, M.; Chen, K.J.; Chowdhury, N.; Chu, R.; Santi, C. de; Souza, M.M. de; Decoutere, S.; Cioccio, L. di; Eckardt, B.; Egawa, T.; Fay, P.; Freedsman, J.J.; Guido, L.; Häberlen, O.; Haynes, G.; Heckel, T.; Hemakumara, D.; Houston, P.; Hu, J.; Hua, M.; Huang, Q.; Huang, A.; Jiang, S.; Kawai, H.; Kinzer, D.; Kuball, M.; Kumar, A.; Lee, K.B.; Li, X.; Marcon, D.; März, M.; McCarthy, R.; Meneghesso, G.; Meneghini, M.; Morvan, E.; Nakajima, A.; Narayanan, E.M.S.; Oliver, S.; Palacios, T.; Piedra, D.; Plissonnier, M.; Reddy, R.; Sun, M.; Thayne, I.; Torres, A.; Trivellin, N.; Unni, V.; Uren, M.J.; Hove, M. van; Wallis, D.J.; Wang, J.; Xie, J.; Yagi, S.; Yang, S.; Youtsey, C.; Yu, R.; Zanoni, E.; Zeltner, S.; Zhang, Y.	Zeitschriftenaufsatz Journal Article
2017	SiC power module loss reduction by PWM gate drive patterns and impedance-optimized gate drive voltages Gerstner, H.; Heckel, T.; Endruschat, A.; Rosskopf, A.; Eckardt, B.; März, M.	Konferenzbeitrag Conference Paper
2017	Application-related characterization and theoretical potential of wide-bandgap devices Endruschat, A.; Heckel, T.; Gerstner, H.; Joffe, C.; Eckardt, B.; März, M.	Konferenzbeitrag Conference Paper
2017	Mechatronic design of 2 kW SiC DC/AC converter with 200 W/inch Menrath, T.; Endres, S.; Zeltner, S.; Matlok, S.; Eckardt, B.	Konferenzbeitrag Conference Paper
2016	Slew rate control of a 600 V 55 mO GaN cascode Endruschat, A.; Heckel, T.; Reiner, R.; Waltereit, P.; Quay, Rüdiger; Ambacher, O.; März, M.; Eckardt, B.; Frey, L.	Konferenzbeitrag Conference Paper
2016	A novel submodule concept for modular multilevel converters Ruccius, B.; Burani, N.; Galek, M.; Malipaard, D.	Konferenzbeitrag Conference Paper
2016	Influence of the junction capacitance of the secondary rectifier diodes on output characteristics in multi-resonant converters Ditze, S.; Heckel, T.; März, M.	Konferenzbeitrag Conference Paper
2016	Inductive power transfer system with a rotary transformer for contactless energy transfer on rotating applications Ditze, S.; Endruschat, A.; Schriefer, T.; Rosskopf, A.; Heckel, T.	Konferenzbeitrag Conference Paper
2016	Implementation of simultaneous energy and data transfer in a contactless connector Trautmann, M.; Joffe, C.; Pflaum, F.; Sanftl, B.; Weigel, R.; Heckel, T.; Koelpin, A.	Konferenzbeitrag Conference Paper
2016	Using SiC MOSFET's full potential - Swichting faster than 200 kV/µs Kreutzer, O.; Heckel, T.; März, M.	Konferenzbeitrag Conference Paper
2016	Silicon integrated RC snubbers for applications up to 900V with reduced mechanical stress and high manufacturability Krach, Florian; Thielen, Nils; Heckel, Thomas; Bauer, A.J.; Erlbacher, Tobias; Frey, Lothar	Konferenzbeitrag Conference Paper
2016	Innovative monolithic RC-snubber for fast switching power modules Krach, F.; Heckel, T.; Frey, L.; Bauer, A.J.; Erlbacher, T.; März, M.	Konferenzbeitrag Conference Paper
2016	Fundamental efficiency limits in power electronic systems Heckel, T.; Rettner, C.; März, M.	Konferenzbeitrag Conference Paper
2015	Integrated galvanically isolated MOSFET and IGBT gate-driver circuit with switching speed control Lorentz, V.R.H.; Schwarz, R.; Heckel, T.; März, M.; Frey, L.	Konferenzbeitrag Conference Paper
2015	A novel charge based SPICE model for nonlinear device capacitances Heckel, T.; Frey, L.	Konferenzbeitrag Conference Paper
2015	SiC MOSFETs in hard-switching bidirectional DC/DC converters Heckel, T.; Eckardt, B.; März, M.; Frey, L.	Konferenzbeitrag Conference Paper
2014	Temperature and electrical field dependence of the ambipolar mobility in n-doped 4H-SiC Hürner, A.; Bonse, C.; Clemmer, G.; Kallinger, B.; Heckel, T.; Erlbacher, T.; Mitlehner, H.; Häublein, V.; Bauer, A.J.; Frey, L.	Konferenzbeitrag Conference Paper
2014	Characterization and application of 600 V normally-off GaN transistors in hard switching DC/DC converters Heckel, T.; Frey, L.; Zeltner, S.	Konferenzbeitrag Conference Paper

Diese Liste ist ein Auszug aus der Publikationsplattform Fraunhofer-Publica

This list has been generated from the publication platform Fraunhofer-Publica