In order to contribute to reducing the carbon footprint of digital technologies with R&D, the Fraunhofer and Leibniz Institutes cooperating in the Research Fab Microelectronics Germany (FMD) are jointly establishing a cross-location competence center for resource-conscious information and communication technology, the Green ICT @ FMD. The BMBF is supporting the project, which was launched on August 1, 2022, with funding of 34 million euros as part of the Green ICT initiative, which is part of the German government's 2030 climate protection program.
In Erlangen, Dresden and Berlin, new application- and system-oriented Green ICT hubs complement existing research activities at the FMD institutes and as a basis for further research work. The hubs offer project partners from industry and science the opportunity to evaluate systems and subsystems, demonstrators and prototypes in dedicated testbeds with regard to the special requirements for environmentally friendly products and, if necessary, to have them optimized. Fraunhofer IISB is participating in two of the Green ICT Hubs with the following activities:
Green-ICT Hub for Sensor Edge Cloud (SEC)
- Further development and optimization of energy-efficient DC/DC voltage converters for use in data centers
- Further development, optimization, implementation and use of sensor systems for the energy-efficient control of manufacturing processes
- Implementation and use of simulation and AI-supported optimization processes to increase energy and resource efficiency in semiconductor production
The Green ICT Hub for resource-optimized electronics production
- Implementation and use of an integrated energy management system and establishment of intelligent operating strategies for the cleanroom energy infrastructure and for process plants along the supply chain exemplified by a process tool from the field of wet chemistry
- Use of artificial intelligence methods to increase compactness through optimal component placement e.g. on PCBs
- Optimization in the manufacturing of power electronic packages
- Replacing other metals with copper to improve the environmental balance in the production and recycling of power electronic junction structures